cnc, optics, precision, rapid prototype
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Semiconductor Lithography Component

Semiconductor Equipment Manufacturer, USA, California

A semiconductor equipment manufacturer required ultra-precision aluminum vacuum chamber components for DUV lithography system. PiPrecision developed specialized machining with thermal control, achieving Ra 0.1 μm surface finish, extreme flatness (λ/10), and sub-micron dimensional tolerances.

Ra 0.1μm
Surface Finish
λ/10
Flatness
Sub-micron
Tolerance
In Production
Status

The Challenge

The DUV lithography application demanded extreme flatness (λ/10), sub-micron dimensional tolerances, Ra 0.1 μm surface finish for diamond-turning readiness, vacuum integrity, and thermal stability during operation.

Our Solution

Developed specialized machining sequence with thermal control and stress-relieving operations, slow-speed machining strategies, temperature-controlled environment, precision grinding and lapping, and extensive metrology verification.

The Results

Ra 0.1 μm surface finish achieved, λ/10 flatness specification met, sub-micron tolerances achieved, components integrated into production lithography system, ongoing supplier relationship established.

Project Gallery

cnc, optics, precision, rapid prototype

Project Info

Industry
Optics
Service
CNC Milling Service
Client
Semiconductor Equipment Manufacturer
Location
USA, California
Completed
September 2024

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